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Purity: The purity of the ceramic sputtering target has a great influence on the performance of the sputtered film. The higher the purity, the better the uniformity of the sputtered film and the consistency of the mass product quality. Density: In order to reduce the pores of the ceramic sputtering......

There are many types of sputtering targets, even targets of the same material have different specifications.

Ceramic targets are relatively brittle targets. Generally, ceramic targets are bound to back plates for use. Back plates can not only support ceramic targets in the sputtering process, but also play a role in heat transfer during the sputtering process. There are many types of ceramic targets with a......

The target-substrate distance in sputtering processes can vary based on the specific equipment, materials, and desired deposition characteristics. However, a common guideline is to maintain a distance between the target and substrate in the range of about 5 to 15 centimeters (2 to 6 inches).

Ceramic Sputtering Target is an important part of the sputtering technology used in the physical vapor deposition (PVD) process. During the sputter deposition process, the ceramic target is placed in the sputtering system, and then high-energy particles (usually inert gas ions such as argon) are use......